-
ID
#55274463 -
Salary
TBD -
Source
Micron -
Date
2026-08-04 -
Deadline
2026-10-03
Wafer Bond Process Development Engineer
Idaho, Boise, 83701 Boise USAFull-time
into intelligence, inspiring the world to learn, communicate and advance faster than ever.Micron is looking for experienced process engineers with experience in the fields of wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP). As a
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