Packaging Engineer, Staff Engineer

Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > ASICS EngineeringGeneral Summary Qualcomm invents foundational technologies that transform how the world connects, computes and communicates. We’ve built on our legacy of developing breakthroughs in 5G, Wi-Fi and AI. But that’s just the beginning. We then designed platforms, chipsets, software, tools and services that help OEMs and developers bring those technologies into products and create experiences that change the way we live and work. And, we do this at scale—building technologically advanced, in-demand end products across a range of industries—from automotive to virtual reality, from smart cars to smartphones to smart cities, and everything in between.Qualcomm Packaging group is responsible for developing new package technologies and HVM deployment for multiple application spaces including mobile, server, automotive, industrial, etc. Our team is responsible for charting and enabling packaging technology roadmaps while working with internal design and product teams; and managing OSATs and suppliers. This is a highly visible role where the candidate will drive all the packaging aspects of the product and provide regular updates to all the internal customers and stakeholders.Job Overview:Developing packaging solutions with 2.5D and 3D packaging technologiesWork cross-functionally with internal teams, substrate suppliers and manage OSATs to deliver on the program timeline and goalsWork with internal design teams and drive DFM methodology for new technologiesJustify and drive the design of test vehicles and own all the development activities including HVM capable process flow, assembly materials, tooling, control plans, etc.Drive the development and improvement of assembly design rules to enable the product roadmapTechnical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to managementRequirements:Good understanding of the F/BEOL processes and materials including low K, ELK dielectrics; RDL and bumpingGood understanding of the assembly materials and processes including die stacking, underfill, molding, etc.Good understanding of package reliability, CPI, thermal and mechanical aspects of molded and lided packagesVery good understanding of FMEA, process capability, metrology, and FA techniquesHands on experience in the die stacking process and OSAT management is preferredStrong team player with excellent project management skillsPreferred:Master’s degree or PhD, is preferred, in mechanical engineering, material science, chemical engineering or electrical engineeringPHYSICAL REQUIREMENTS: Frequently transports between offices, buildings, and campuses up to ½ mile.

Frequently transports and installs equipment up to 5 lbs.

Performs required tasks at various heights (e.g., standing or sitting).

Monitors and utilizes computers and test equipment for more than 6 hours a day.

Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.

Minimum Qualifications Education:Bachelors - Engineering, Bachelors - ScienceWork Experiences:5+ years ASIC design, verification, or related work experience.Certifications:Skills:Preferred Qualifications Education:Bachelors - Electrical EngineeringWork Experiences:1+ years of work experience in a role requiring interaction with senior leadership (e.g., Director level and above). ,2+ years experience with architecture and design tools.Certifications:Skills:ASIC Verification, Matlab C, Multicore System-On-Chip (SoC), Perl Programming, Simulation SoftwareApplicants : If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hrpublicarticleview&sysparmarticle=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.Equal Employment Opportunity: https://www.eeoc.gov/sites/default/files/migratedfiles/employers/posterscreenreaderoptimized.pdf"EEO is the Law" Poster Supplement : https://www.dol.gov/sites/dolgov/files/ofccp/regs/compliance/posters/pdf/OFCCPEEOSupplementFinalJRFQA508c.pdfPay Transparency NonDiscrimination Provision: https://www.dol.gov/sites/dolgov/files/ofccp/pdf/pay-transp%20EnglishformattedESQA508c.pdfEmployee Polygraph Protection Act: https://www.dol.gov/sites/dolgov/files/WHD/legacy/files/eppac.pdfFamily Medical Leave Act: https://www.dol.gov/sites/dolgov/files/WHD/legacy/files/fmlaen.pdfRights of Pregnant Employees: https://www.dfeh.ca.gov/wp-content/uploads/sites/32/2020/12/Your-Rights-and-Obligations-as-a-Pregnant-EmployeeENG.pdfDiscrimination and Harassment: https://www.dfeh.ca.gov/wp-content/uploads/sites/32/2020/10/Workplace-Discrimination-PosterENG.pdfCalifornia Family Rights Act: https://www.dfeh.ca.gov/wp-content/uploads/sites/32/2020/12/CFRA-and-Pregnancy-LeaveENG.pdf