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  • ID
    #53495841
  • Job type
    Full-time
  • Salary
    TBD
  • Source
    Renesas Electronics
  • Date
    2025-02-20
  • Deadline
    2025-04-21
 
Full-time

Design and develop hermetic/ceramic/metal and RAD(radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging.Package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability power applications.Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay).Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD.Work with OSAT(Outsourced Semiconductor Assembly & Test )/Palm Bay to run DOE to optimize processes and establish process spec.Work with Product groups and Reliability team, qualify new packages and processes within required schedule from Product Engineer/Program manager.Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages.Participate in packaging roadmap development & focus on execution.

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