ID
#55250067
Job type
Full-time
Salary
$85.2k - $162.5k
Source
Intel Corporation
Date
2026-07-31
Deadline
2026-09-29

Packaging Module Development Engineer

Arizona, Phoenix, 85001

Full-time

Job Details:

Job Description:

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor
Salary:$85.2k - $162.5k

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