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  5. Senior Microelectronics Test Engineer
  • ID
    #45288097
  • Job type
    Permanent
  • Salary
    TBD
  • Source
    BOEING
  • Date
    2022-08-29
  • Deadline
    2022-10-28

Senior Microelectronics Test Engineer

 Maryland, Crownsville, 21032 Crownsville USA
 
Permanent

Vacancy expired!

Job Description

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We're committed to fostering an environment for every teammate that's welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Boeing's Solid State Electronics Development organization (SSED), within the Boeing Research and Technology (BR&T) organization, performs microelectronics technology development and design for aerospace systems.

We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED's large staff of microelectronics engineers conduct research and designs microelectronics hardware in support of these projects.

We are seeking Senior Microelectronics Test Engineer to perform microelectronics test, verification, and characterization/analysis of custom digital, analog/mixed-signal, and RF SoCs die and packaged devices.

This position will be based out of Huntington Beach CA, Annapolis Junction MD, or Huntsville AL.

This position allows telecommuting. The selected candidate will be required to perform some work onsite at one of the listed location options.

This position requires the ability to obtain a US Security Clearance for which the US Government requires US Citizenship as a condition of employment. An interim and/or final U.S. Secret Clearance Post-Start is required.

Position Responsibilities:
  • Test and characterization of integrated circuits
  • Working with digital, mixed signal, RF/microwave electronics
  • Working with Field Programmable Gate Arrays

Basic Qualifications (Required Skills and Experience)
  • Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
  • 3+ years of experience in the design and test of integrated circuits
  • Experience utilizing electrical test equipment such as digital multi-meter, spectrum analyzer, signal generator, vector network Analyzer and oscilloscope

Preferred Qualifications (Desired Skills/Experience):
  • Experience analyzing and decomposing higher-level requirements to microelectronics-level requirements, interfaces, and test.
  • Experience developing test and verification plans and procedures.
  • Experience applying design-for-testability strategies and methods.
  • Experience supporting electronics testing, including designing test boards, writing test scripts (e.g. in LabView), writing test plans, and generating concise reports.
  • Experience with design and test of electronics for extreme temperature environments (e.g. cryogenic).
  • Experience with radiation effects on electronics including related testing (e.g. spacecraft electronics).
  • Experience extracting microelectronics performance parameters and building simulation models.
  • Experience supporting gate reviews (SRR, PDR, CDR, TRR) including generating and presenting material to upper management and other stakeholders.
  • Design experience in analog, digital, mixed signal, RF, or SoC domains or experience designing and/or testing chips in more than one domain or FPGA.
  • Experience working on large-scale SoC design teams.
  • Experience with architecture and design of packaged electronics (e.g. hybrid, module, system-in-package, heterogeneous, stacked).
  • Experience writing firmware or software for embedded systems.
  • Experience supporting military programs.
  • Demonstrated track record as a self-motived, independent, high-performance team member.
  • Excellent verbal and written communication ability.
  • Experience organizing and leading teams.
  • Active security clearance.

Typical Education/Experience: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 14 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+9 years' related work experience, Master+12 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Relocation: This position offers relocation based on candidate eligibility

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift: This position is for first shift.

BRTMSA

Equal Opportunity Employer:

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.

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