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Principal Mechanical Engineer (Hybrid) : 2022-01-18
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  • ID
    #31954651
  • Salary
    USD TBD TBD
  • Source
    Raytheon Technologies
  • Date
    2022-01-18
  • Deadline
    2022-03-19
 
Full-time

Vacancy expired!

The Secure Sensor Solutions RF Mechanical Design Department is currently seeking a Principal Mechanical Engineer for the Radar Antenna Design organization in El Segundo, CA to support, develop, and advance airborne Active Electronically Scanned Array (AESA) antenna technologies for the next generation of radars. The Radar Antenna Design organization has been at the forefront of light weight, low profile, cost effective, and highly integrated AESA solutions for challenging missions. Area specialties include compact radiator technologies with integrated circulator packaging, TR module design and testing, and custom CCA designs that optimize available platform volumes. The Principal Mechanical Engineer primary job responsibilities include project and technical leadership for new development efforts that aim to increase the technical readiness level and manufacturing readiness level of antenna components and fully deployable designs. The position will include team leadership of a cross-functional team of hardware engineers, while simultaneously developing innovative solutions to customer needs. This position will include oversight of product engineering from conceptual hardware design to detailed mechanical and electrical design, manufacturing and qualification. The Principal Mechanical Engineer will be directly applying engineering expertise and working with cross-functional teams to define product architecture solutions for airborne radar antennas meeting the highest customer expectations. RF array designs may include flared notch, stepped notch, long slot, and PCB based radiators with or without integrated circulators. Array electronics may include high density electronic packaging designs and electronic components / devices such as ASICs and FPGAs, design of electronic packaging chassis and structures, interconnects, thermal control design of high-density electronic systems and electronic enclosures, adhering to design constraints such as size, weight, power, and design to cost. Candidate will be expected to follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met. Responsibility for the Quality, Timeliness, Completeness and Efficiency (QTCE) of these work products and monitoring/improving QTCE through metrics and process improvements is also required. Contacts are primarily with program management, customers, members of engineering team, immediate section manager, project leaders and other personnel (peers) within the applicable program.The Principal Mechanical Engineer shall be a highly motivated “self-starter” able to lead by example, possessing a strong hardware architecture development background in both mechanical and RF design with the ability to drive research and development teams with innovative solutions to challenging design criteria. This position requires strong interpersonal, written and verbal communication skills to maintain positive relationships & satisfaction with Programs leadership (Engineering and Program Management). Experience designing high reliability, high uniformity, low cost products from beginning to end and dealing with contract manufacturers on quick turn schedules is highly desired. Familiarity with precision machining techniques and characterization of radiator performance is highly desired. Experience with system requirements development is desired. Experience with capture and proposals is a plus. Required Skills:

Vacancy expired!